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SMD & SMT Power Inductors
 
  SMT & SMD Power Inductor Specifications

Environmental
Item
Specification
Test Method / Condition
Static Humidity After exposure, part remains within specified electrical parameters for L, Q and DCR Precondition at 25c for 60 minutes. Expose parts to an environment of +40c with 90 to 95% R.H. for 240 hours
Storage Life After exposure, part remains within specified electrical parameters for L, Q and DCR Subject parts to an environment of 85c 85% RH for 168 hours. After exposure allow parts to dry for 4 hours before measurements are taken.
Temperature Cycle After exposure, part remains within specified electrical parameters for L, Q and DCR 10 cycles of the following
30 minutes at +85c
30 minutes at -40c
Allow 20 minutes transition between extremes
Temperature Shock After exposure, part remains within specified electrical parameters for L, Q and DCR 10 cycles (Air to Air) 1 cycle consists of:
30 minutes exposure to -55c
30 minutes exposure to 125c
15 seconds maximum transition between temperatures
General
Storage
Temperature Range
-40 to +85c  
Operating
Temperature Range
-40 to +85c  
Flammability IEC 695-2-2 Withstands needle-flame test (TSL1807 Series, please consult)
Other
Vibration After exposure, part remains within specified electrical parameters for L, Q and DCR

1 cycle of 30 minutes of the following:
5-7Hz constant displacement of .75 inch, 5 min
7-30Hz constant acceleration of 1.5Gs, 10mins
30-50Hz constant displacement of 0.033 inch, 5 mins
50-500Hz constant acceleration of 1.2Gs, 10 mins

Resistance to
Soldering Heat
After exposure, part remains within specified electrical parameters for L, Q and DCR Inductors shall be reflowed onto a PC board using 63Sn/37Pb solder paste. Solder process shall be 230c for 20±2 seconds and 260c for 5±2 seconds
Mechanical Shock After exposure, part remains within specified electrical parameters for L, Q and DCR Test per MIL-STD 202 method 213 test condition A. Test mounted samples 3 axes, 6 times, totalling 18 shocks (500G's 11ms, half-sine).
Solderability Wetting shall cover 90% minimum of each termination Dip pads in RMA flux, 63/37 solder (sn/pb) at 232c for 5±2 seconds
Component Adhesion
(Push Test)
Component must withstand 6lb push force minimum without delaminating from mounting surface Apply and measure force with a digital force gauge set.
Resistance to
Solvent
  Withstands 6 minutes of alcohol
 
 
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