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SMT & SMD Power Inductor SpecificationsEnvironmental | General | Other
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| Item | Specification | Test Method / Condition |
| Vibration | After exposure, part remains within specified electrical parameters for L, Q and DCR | 1 cycle of 30 minutes of the following: 5-7Hz constant displacement of .75 inch, 5 min 7-30Hz constant acceleration of 1.5Gs, 10mins 30-50Hz constant displacement of 0.033 inch, 5 mins 50-500Hz constant acceleration of 1.2Gs, 10 mins |
| Resistance to Soldering Heat |
After exposure, part remains within specified electrical parameters for L, Q and DCR | Inductors shall be reflowed onto a PC board using 63Sn/37Pb solder paste. Solder process shall be 230c for 20±2 seconds and 260c for 5±2 seconds |
| Mechanical Shock | After exposure, part remains within specified electrical parameters for L, Q and DCR | Test per MIL-STD 202 method 213 test condition A. Test mounted samples 3 axes, 6 times, totalling 18 shocks (500G's 11ms, half-sine). |
| Solderability | Wetting shall cover 90% minimum of each termination | Dip pads in RMA flux, 63/37 solder (sn/pb) at 232c for 5±2 seconds |
| Component Adhesion (Push Test) |
Component must withstand 6lb push force minimum without delaminating from mounting surface | Apply and measure force with a digital force gauge set. |
| Resistance to Solvent |
Withstands 6 minutes of alcohol |